The Prominence UFLCXR system is up to 10 times faster than a conventional HPLC system that uses a 5-µm particle column. Together, they represent the ultimate solution." "When presented with a unique challenge that demands the use of longer columns for extra resolution, users can convert their current Prominence UFLC to an XR system or can purchase a new UFLCXR system. room temperature shear strengths around 13,000 - 17,000 psi ( 90 - 120 MPa). "Fast chromatography at reasonable pressures is the most robust solution for generating highly reproducible data and the Prominence UFLC gives users just that," said Curtis R. Unlike many high-pressure systems, the system delivers data with high integrity and reproducibility, a result of fully re-engineered components in the injection valve.
#9500 psi to mpa series#
Optimized to enable high-speed analysis using the Shim-pack XR-ODS II series of columns (2 mm and 3 mm with 8 nm pores), the Prominence UFLCXR is capable of system pressures up to 9500 psi (66 MPa) for special situations that demand extra resolution (XR). Thanks to its Direct Injection with Isolated Metering System (DIIMS) (patent pending), only Shimadzu's Prominence UFLCXR can achieve high speed, high precision, low carryover and good linearity - all at the same time. 62.052816 MPa: 9,500 Psi: 65.500194 MPa: 10,000 Psi: 68.947573 MPa: 1 psi to mpa 10 psi to mpa 20 psi to mpa 30 psi to mpa 50 psi to mpa 100 psi to mpa 200 psi to mpa 300 psi to mpa 400 psi to mpa 500 psi to mpa 600 psi to mpa 700 psi to mpa 800 psi to mpa 900 psi to mpa 1000 psi to mpa 30000000 psi to mpa. Even at a high-pressure configuration, this flexible system delivers results without loss in basic chromatographic performance. At operating temperature, TLP joints made within the In-Sn-Cu system were found to have strengths an order of magnitude higher than those made in the In-Sn-Bi-Cu system.Adding to its Prominence line of HPLC chromatography products, Shimadzu Scientific Instruments introduced the Prominence UFLCXR, an ultra fast liquid chromatograph (UFLC) with extra resolution, at Pittcon 2008 on March 1. Most of the TLP joints had room temperature shear strengths around 13,000 - 17,000 psi (= 90 - 120 MPa), although increases in strength were observed for eutectic In-Sn joints with 2.5 and 5 wt% Cu additions. Shear tests were performed on the joints at room (25☌) and operating (service) temperatures (100☌). Application of the Ni layer was observed to decrease the growth rate of the eutectic In-Sn joints made with 5 wt % Cu additions.
#9500 psi to mpa how to#
Increases in nominal Cu composition of the interlayer alloy tended to form larger joints. How to Convert Psi to Megapascal 1 psi 0.0068947573 MPa 1 MPa 145.03773773 psi Example: convert 15 psi to MPa: 15 psi 15 × 0.0068947573 MPa 0.
It was found that interlayer alloys containing higher Bi contents produced the thinnest joints, with the 48.3In-15.6Sn-36.1Bi alloy producing joints on the order of 10 gm. 1 psi to MPa 0.00689 MPa 10 psi to MPa 0.06895 MPa 50 psi to MPa 0.34474 MPa 100 psi to MPa 0.68948 MPa 200 psi to MPa 1.37895 MPa 500 psi to MPa 3.447 psi to MPa 6. The LTTLP processes were assessed based on their abilities to produce joints with minimal thickness, high reflow temperatures, and good mechanical properties at room/elevated temperatures. In addition, novel approaches to TLP bonding, including the addition of base material to the interlayer alloy and application of an electroless Ni diffusion barrier layer, were employed in an attempt to optimize this joining method. We assume you are converting between pound/square inch gauge and megapascal.
%) of base alloys were chosen to accomplish this task: 50In-43.6Sn-6.4Bi (Tm = 110☌) and eutectic 50.9In-49.1Sn (Tm = 120☌) alloys were used for bonding at 125☌ and a eutectic 48.3In-15.6Sn-36.1Bi (Tm = 60☌) alloy was used for bonding at 75☌.
Using thermodynamic models, three different compositions (wt. A fluxless low temperature transient liquid phase (LTTLP) bonding process was studied as a method of producing Cu/Cu joints below 125☌ and 75☌ using interlayer alloys from the In-Sn and In-Sn-Bi systems.
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